SIA922EDJ Datasheet, PDF (1/9 Pages) Vishay Telefunken – Dual N-Channel 30 V (D-S) MOSFET

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SiA922EDJ
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) () MAX.
0.064 at V_GS = 4.5 V
0.072 at V_GS = 3.0 V
0.080 at V_GS = 2.5 V
0.400 at V_GS = 1.8 V
I_D (A)
4.5^a
4.5^a
4.5^a
0.2
Q_g (TYP.)
3.5 nC
PowerPAK SC-70-6 Dual
FEATURES
• TrenchFET^® Power MOSFET
• Thermally enhanced PowerPAK^® SC-70 package
- Small footprint area
- Low on-resistance
• Typical ESD protection: 1500 V (HBM)
• 100 % R_g tested
• Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
1
S1
D1
D1
6
G2
5
2.05 mm S₂
4
2
G1
D2
3
D2
2.05 mm
Ordering Information:
SiA922EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
Part # code
CIX
XXX
Marking Code
Lot Traceability
and Date code
APPLICATIONS
• Portable devices such as smart phones, tablet PCs and
mobile computing
- Load switch
- DC/DC converter
- Power management
D₁
D₂
G₁
G₂
N-Channel MOSFET S1 N-Channel MOSFET S₂
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
V_GS
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (t = 300 μs)
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^d,e
I_DM
I_S
P_D
T_J, T_stg
LIMIT
30
± 12
4.5^a
4.5^a
4.4^{b, c}
3.5^{b, c}
15
4.5^a
1.6^{b, c}
7.8
5
1.9^{b, c}
1.2^{b, c}
-55 to 150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient_{b, f}
Maximum Junction-to-Case (Drain)
t5s
Steady State
R_thJA
R_thJC
52
12.5
65
°C/W
16
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state condition is 110 °C/W.
S13-2266-Rev. B, 04-Nov-13
1
Document Number: 62818
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000