SIA466EDJ Datasheet, PDF (1/9 Pages) Vishay Telefunken – N-Channel 20 V (D-S) MOSFET

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SiA466EDJ
Vishay Siliconix
N-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
20
R_DS(on) (Ω) MAX.
0.0095 at V_GS = 10 V
0.0111 at V_GS = 6 V
0.0130 at V_GS = 4.5 V
I_D (A) ^a
25
25
25
PowerPAK^® SC-70-6L Single
D
D6
S5
4
Q_g (TYP.)
6.3 nC
S
1 _2.05 ^mm
Top View
1
2D
3D
G
Bottom View
Marking Code: AW
Ordering Information:
SiA466EDJ-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• TrenchFET^® power MOSFET
• Thermally enhanced PowerPAK^® SC-70 package
- Small footprint area
- Low on-resistance
• Typical ESD protection: 2500 V (HBM)
• 100 % R_g Tested
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
D
• For smart phones and mobile
computing
- DC/DC converters
- Power management
G
- Load switches
N-Channel MOSFET
S
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C) ^a
Pulsed Drain Current (t = 300 μs)
Continuous Source-Drain Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
T_C = 25 °C
T_A = 25 °C
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
LIMIT
20
± 20
25 ^a
25 ^a
15.1 ^{b, c}
12.1 ^{b, c}
50
16
2.9 ^{b, c}
19.2
12.3
3.5 ^{b, c}
2.2 ^{b, c}
-55 to 150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
R_thJA
28
Steady State
R_thJC
5.3
36
°C/W
6.5
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
S14-1065-Rev. A, 19-May-14
1
Document Number: 62955
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000