SI7456DDP Datasheet, PDF (1/13 Pages) Vishay Siliconix – N-Channel 100 V (D-S) MOSFET

New Product
N-Channel 100 V (D-S) MOSFET
Si7456DDP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.023 at V_GS = 10 V
100
0.024 at V_GS = 7.5 V
0.031 at V_GS = 4.5 V
I_D (A)^a
27.8
27.2
24
Q_g (Typ.)
9.7 nC
PowerPAK^® SO-8
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
Bottom View
Ordering Information:
Si7456DDP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• DC/DC Primary Side Switch
• Telecom/Server 48 V,
D
Full/Half-Bridge DC/DC
• Industrial
• Synchronous Rectification
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
100
V
V_GS
± 20
T_C = 25 °C
27.8
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
22.2
10.4^{b, c}
Pulsed Drain Current (t = 300 µs)
T_A = 70 °C
8.2^{b, c}
A
I_DM
70
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
25
4.5^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L =0.1 mH
I_AS
15
E_AS
11.2
mJ
T_C = 25 °C
35.7
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
22.8
5^{b, c}
W
T_A = 70 °C
3.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
Notes:
t  10 s
R_thJA
20
Steady State
R_thJC
2.9
25
°C/W
3.5
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
Document Number: 67869
For technical questions, contact: [e-mail]
www.vishay.com
S12-1261-Rev. A, 21-May-12
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000