SI7224DN Datasheet, PDF (1/18 Pages) Vishay Siliconix – Dual N-Channel 30-V (D-S) MOSFET

New Product
Dual N-Channel 30-V (D-S) MOSFET
Si7224DN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
0.035 at V_GS = 10 V
Channel 1 30
0.042 at V_GS = 4.5 V
0.028 at V_GS = 10 V
Channel 2 30
0.035 at V_GS = 4.5 V
I_D (A)
6^a
6^a
6^a
6^a
Q_g (Typ.)
4.5 nC
5.5 nC
PowerPAK^® 1212-8
FEATURES
• Halogen-free Option Available
• TrenchFET^® Power MOSFETs
APPLICATIONS
• Notebook PC System Power
• Low Current POL
RoHS
COMPLIANT
3.30 mm
D1
8
D1
7
D2
6
D2
5
S1
1
G1
2
3.30 mm
S2
3
G2
4
Bottom View
Ordering Information: Si7224DN-T1-E3 (Lead (Pb)-free)
Si7224DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
D₁
D₂
G₁
G₂
S₁
N-Channel MOSFET
S₂
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Channel 1
Channel 2
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V_GS
± 16
30
± 20
V
Continuous Drain Current (T_J = 150 °C)
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
6^a
6^a
6^{a, b, c}
6^a
6^a
6^{a, b, c}
T_A = 70 °C
5.2^{b, c}
5.9^{b, c}
A
Pulsed Drain Current
I_DM
25
30
Source Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
6^a
1.7^{b, c}
6^a
2.2^{b, c}
T_C = 25 °C
17.8
23
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
11.4
2.5^{b, c}
14.8
2.6^{b, c}
W
T_A = 70 °C
1.6^{b, c}
1.7^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Channel 1
Channel 2
Parameter
Symbol
Typ. Max. Typ. Max.
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
Notes:
t ≤ 10 s
Steady State
R_thJA
R_thJC
40
50
38
48
5.6
7
4.3
5.4
°C/W
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequade bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 94 °C/W.
Document Number: 69500
S-81549-Rev. B, 07-Jul-08
www.vishay.com
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