108-115008 Datasheet, PDF (4/8 Pages) TE Connectivity Ltd – Shield Finger Scalable Height From 1.24mm to 3.4mm

3.5.15
3.5.16
3.5.17
3.5.18
3.5.19
Condensation test– Initial: 80 mǡ Max.
operational
Final: R 25 mǡ Max.
Sulfuration for gold
surface
No physical damage shall
occur.
Initial: 80 mǡ Max.
Final: R 25 mǡ Max.
Peeling off strength
Resistance to re-flow
soldering heat
2N minimum in vertical to
PCB direction.
15N minimum in Long pad
direction.
10N minimum in Short pad
direction.
No physical damage shall
occur.
Vibration Sinusoidal
No discontinuities of 1
microsecond or longer
duration.
80 milliohms Max.(Initial)
R 25 milliohms
Maximum.(Final)
Subject mated specimen at nominal
working height to test condition as
Figure 9.
Subject mated specimens to the
environment:
H2S: 3ppm
Temperature: 40+/-2°C
Humidity: 75+/-3 %
Duration: 24h
Subject soldered specimens to the
test condition as
Figure 10( vertical to PCB direction)
Figure 11(Long pad direction)
Figure 12(Short pad direction)
Subject specimens to reflow process
for 3 times per IPC/JEDEC J-STD-20,
table 5-2.
Moisture sensitivity should meet at
lease level 2 per IPC/JEDEC J-STD-
20, table 5-1.
Subject mated specimens at nominal
working height to sinusoidal vibration
over a specified frequency range of
10~500Hz. The X, Y and Z axes of
the mated samples are subjected to 5
sweep cycles/axis.
Temperature: 23+/-5°C.
Humidity: 35~70%RH.
Duration: approximately 1hour/axis
Figure 1
Shall meet visual requirements, show no physical damage, and meet requirements of
additional tests as specified in the Product Qualification and Requalification Test Sequence
shown in Figure 2.
PAGE NO
TE Connectivity (Shanghai)
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ASHL-0005- ES REV A
108-115008
REV LOC
A2 _ES