108-115008 Datasheet, PDF (3/8 Pages) TE Connectivity Ltd – Shield Finger Scalable Height From 1.24mm to 3.4mm

3.5.7
3.5.8
3.5.9
3.5.10
3.5.11
3.5.12
3.5.13
Shock
Vibration, Random
Solderability
Thermal shock
Heat test
(non operational)
Cold test
(non operational)
Heat test
(operational)
No discontinuities of 1
Subject mated specimens to 30G’s
microsecond or longer
half-sine shock pulses of 6
duration.
milliseconds duration. Three shocks
80 milliohms Max.(Initial)
in each direction applied along 3
R 25 milliohms
mutually perpendicular planes, 18
Maximum.(Final)
shocks.
See Figure 3
No discontinuities of 1
Subject mated specimens at nominal
microsecond or longer
working height
duration.
5 Hz 0.1m2/s3
80 milliohms Max.(Initial)
12 Hz 2.2 m2/s3
R 25 milliohms
20Hz 2.2. m2/s3
Maximum.(Final)
200Hz 0.04 m2/s3
500Hz 0.04 m2/s3
Temperature: 23+/-5°C.
Humidity: 35~70%RH.
Solder wetting time shall be
2 hours for X&Y&Z.
Refer to JESD22-B102E.
no more than 3 seconds. A Lead free soldering.
new uniform coating of
solder shall cover a minimum
of 95% of the surface being
immerged.
Environment Requirements
Initial: 80 mǡ Max.
Subject mated specimen at nominal
Final: R 25 mǡ Max.
working height to 256 cycles between
-40 and 85°C with 30 minute dwells
including 0~5 minute transition time.
See Figure 6.
Initial: 80 mǡ Max.
Subject mated specimen at nominal
Final: R 25 mǡ Max.
working height to 85+/-3 °C, 50+/-
5%RH, 16h. See Figure 4
Initial: 80 mǡ Max.
Subject mated specimen at nominal
Final: R 25 mǡ Max.
working height to -40+/-3 °C, 16h.
See Figure 5.
Initial: 80 mǡ Max.
Subject mated specimen at nominal
Final: R 25 mǡ Max.
working height to test condition as
Figure 7.
3.5.14
Cold test
(operational)
Initial: 80 mǡ Max.
Final: R 25 mǡ Max.
Subject mated specimen at nominal
working height to test condition as
Figure 8.
PAGE NO
TE Connectivity (Shanghai)
3/8
ASHL-0005- ES REV A
108-115008
REV LOC
A2 _ES