C4532X7T2W474K230KE Datasheet, PDF (26/64 Pages) TDK Electronics – TDK MLCC PRODUCT LINE

C SERIES | Soft Termination Capacitor
TDK Soft Termination Series is designed for use in applications where
significant board flex may occur. Safety/critical automotive applications such
as ABS, ESP, airbag, and battery line applications are common examples.
Conventional termination materials used in standard MLCCs are
inflexible; therefore vibration, shock, or thermal expansion and contraction
have the potential to crack or shear the solder joint between the component
and the circuit board. Automotive applications, which are exposed to shock,
vibration and extreme temperature swings, can result in higher failure rates in
the field with conventional capacitors. TDK’s new soft termination provides
high resistance to mechanical and thermal stress to ensure the component can
meet the requirements of automotive OEMs. Other application such as
measurement instruments used in environment with frequent temperature
swings can benefit as well.
L
B
T
B
W
Case Code
C2012 (0805)
C3216 (1206)
C3225 (1210)
C4532 (1812)
C5750 (2220)
C7563 (3025)
L (mm)
2.10
3.30
3.20
4.50
5.70
7.50
25
L Body Length
W Body Width
T Body Height
B Terminal Width
W (mm)
1.25
1.60
2.50
3.20
5.00
6.30
T max (mm)
1.25
1.60
2.50
2.50
2.50
2.70
Part Number Description
TEMPERATURE CHARACTERISTICS
PACKAGING STYLE
RATED VOLTAGE (DC)
INTERNAL CODES
C3216
X7R
1E
106
K
T
���S
SERIES NAME & DIMENSION CODE
CAPACITANCE TOLERANCE
NOMINAL CAPACITANCE (pF)
Features:
 Improved board bending resistance, drop impact resistance,
thermal shock resistance, and heat cycle properties
 Conductive resin absorb external stress to protect solder joint
parts and capacitor body
 RoHS, WEE, and REACH compliant
Applications:
 Switching power supply
 Telecom base station
 Electronic circuits mounted on alumina substrate
 SMT application which requires bending robustness in
which solder joint reliability is problematic
Standard Termination
Sn
Ni
Cu
Soft Termination
Sn
Ni
Cu
Resin
Electrode
 A resin electrode layer between the copper base and the nickel plating of the terminal electrode
absorbs bending stress from the board and suppresses the forming of solder cracks. Conductive
resin is made of epoxy mixed with a filler of conductive particles.
©TDK Corporation of America – Contents are subject to change without notice.