ESDAVLC5-4BX4 Datasheet, PDF (6/8 Pages) STMicroelectronics – 4 bidirectional Transil diodes

Recommendation on PCB assembly
3
Recommendation on PCB assembly
ESDAVLC5-4BX4
3.1
PCB design recommendations
• PCB pad design: Non solder mask defined
• PCB pad size: see Figure 12.
• Solder mask opening: 50 µm between the edge of the pad and the edge of the solder
mask
3.2
Stencil recommendations
• Stencil aperture: see Figure 12.
• Stencil thickness: 75 µm
Figure 12. Micro package footprint and stencil (dimensions in mm)
0.05
Stencil opening
0.20
0.15
Solder mask opening
0.25
0.25
Copper pad dimensions
0.25
3.3
Solder paste recommendations
Near eutectic 95.8% Sn, 3.5% Ag, 0.7% Cu solder paste, Type 4.
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DocID023365 Rev 2