ESDAVLC5-4BX4 Datasheet, PDF (4/8 Pages) STMicroelectronics – 4 bidirectional Transil diodes

Package information
2
Package information
ESDAVLC5-4BX4
• Epoxy meets UL94, V0
• Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 9. Micro package dimensions
Thickness: 350 ±30 µm
200 ±16 µm
250 ^{±16 µm}
200 ^{±16 µm}
250 _{±16 µm}
706 ±16 µm
800 ±30 µm
Figure 10. Marking
EXJ
YWW
Note:
The marking codes can be rotated by 90° or 180° to differentiate assembly location. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
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DocID023365 Rev 2