English
Language : 

STD7N90K5 Datasheet, PDF (5/16 Pages) STMicroelectronics – Ultra-low gate charge
STD7N90K5
Symbol
Parameter
td(on)
Turn-on delay
time
tr
td(off)
Rise time
Turn-off delay
time
tf
Fall time
Table 7: Switching times
Test conditions
Electrical characteristics
Min. Typ. Max. Unit
VDD= 450 V, ID = 3.5 A, RG = 4.7 Ω
- 13.2 -
ns
VGS = 10 V
- 14.2 -
ns
(see Figure 14: "Test circuit for resistive
load switching times" and Figure 19:
- 31.6 -
ns
"Switching time waveform")
- 14.7 -
ns
Symbol
Parameter
ISD
Source-drain
current
ISDM(1)
Source-drain
current (pulsed)
VSD(2)
Forward on
voltage
trr
Reverse recovery
time
Qrr
Reverse recovery
charge
IRRM
Reverse recovery
current
trr
Reverse recovery
time
Qrr
Reverse recovery
charge
IRRM
Reverse recovery
current
Table 8: Source-drain diode
Test conditions
ISD = 7 A, VGS = 0 V
ISD = 7 A, di/dt = 100 A/µs,VDD = 60 V
(see Figure 16: "Test circuit for
inductive load switching and diode
recovery times")
ISD = 7 A, di/dt = 100 A/µs VDD = 60 V,
Tj = 150 °C
(see Figure 16: "Test circuit for
inductive load switching and diode
recovery times")
Notes:
(1)Pulse width limited by safe operating area
(2)Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Min. Typ. Max. Unit
-
7
A
-
28 A
-
1.5 V
- 352
ns
- 3.63
µC
- 20.6
A
- 525
ns
- 4.94
µC
- 18.8
A
Symbol
V(BR)GSO
Parameter
Gate-source
breakdown
voltage
Table 9: Gate-source Zener diode
Test conditions
Min. Typ. Max. Unit
IGS= ± 1mA, ID= 0 A
±30 -
-
V
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD
performance of the device. The Zener voltage facilitates efficient and cost-effective device
integrity protection, thus eliminating the need for additional external componentry.
DocID029862 Rev 1
5/16