English
Language : 

STB10N95K5 Datasheet, PDF (5/22 Pages) STMicroelectronics – Switching applications
STB10N95K5, STF10N95K5, STP10N95K5, STW10N95K5
Electrical characteristics
Symbol
Table 6. Switching times
Parameter
Test conditions
td(on)
tr
td(off)
tf
Turn-on delay time
Rise time
Turn-off-delay time
Fall time
VDD = 475 V, ID = 4 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 19)
Min. Typ. Max Unit
- 22 - ns
- 14 - ns
- 51 - ns
- 15 - ns
Symbol
Table 7. Source drain diode
Parameter
Test conditions
ISD Source-drain current
(1)
ISDM Source-drain current (pulsed)
(2)
VSD Forward on voltage
ISD = 8 A, VGS = 0
trr
Qrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 8 A, di/dt = 100 A/μs
VDD= 60 V
(see Figure 21)
trr
Qrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 8 A, di/dt = 100 A/μs
VDD= 60 V TJ = 150 °C
(see Figure 21)
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration = 300 μs, duty cycle 1.5%
Min. Typ. Max Unit
A
-
8
-
32 A
-
1.5 V
- 404
ns
- 5.2
μC
- 25.5
A
- 596
ns
- 6.9
μC
- 23
A
Symbol
Table 8. Gate-source Zener diode
Parameter
Test conditions
Min Typ. Max. Unit
V(BR)GSO Gate-source breakdown voltage IGS = ± 1mA, ID=0
30 -
-
V
The built-in back-to-back Zener diodes have been specifically designed to enhance not only
the device’s ESD capability, but also to make them capable of safely absorbing any voltage
transients that may occasionally be applied from gate to source. In this respect, the Zener
voltage is appropriate to achieve efficient and cost-effective protection of device integrity.
The integrated Zener diodes thus eliminate the need for external components.
DocID024850 Rev 3
5/22
22