STBCFG01 Datasheet, PDF (33/37 Pages) STMicroelectronics – Integrated current sensing resistor

STBCFG01
Package information
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
7.1
Flip Chip 25 (2.3x2.2 mm) option H package information
Figure 10: Flip Chip 25 (2.3x 2.2 mm) option H package outline
DocID026474 Rev 3
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