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STBP112 Datasheet, PDF (25/38 Pages) STMicroelectronics – Overvoltage protection device
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STBP112
6
Maximum rating
Maximum rating
Stressing the device above the rating listed in Table 2 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in Section 3 on page 10 of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics™ SURE program and other relevant
documentation.
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
TSTG
TSLD(1)
Storage temperature (VIN off)
Lead solder temperature for 10 seconds
-55 to 150 °C
260
°C
TJ
Operating junction temperature range (internally limited to Toff) -40 to 150 °C
VIN
IN pin input voltage
-0.3 to 30 V
VOUT OUT pin input/output voltage
-0.3 to 12 V
VIO
Input/output voltage (other pins)
-0.3 to 7
V
ILOAD Load current (IN to OUT)
TA ≤ 50 °C
TA = 85 °C
2000
mA
1500
mA
IREVERSE Reverse diode current (OUT to IN)
500
mA
ISINK(FLT) FLT pin sink current
15
mA
VESD
ESD withstand voltage (IEC 61000-4-2, IN pin only)(2)
Human body model (HBM), model = 2(3)
±15 (air),
±8 (contact)
kV
2000
V
Machine model (MM), model = B(4)
200
V
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
2. System-level value (see typical application circuit, C1 ≥ 1 µF low ESR ceramic capacitor).
3. Human body model, 100 pF discharged through a 1.5 kΩ resistor according to the JESD22/A114
specification.
4. Machine model, 200 pF discharged through all pins according to the JESD22/A115 specification.
Table 3. Thermal data
Symbol
Parameter
Value
Unit
RthJA Thermal resistance (junction-to-ambient)
59(1)
°C/W
RthJC Thermal resistance (junction-to-case)
5.9
°C/W
1. The package was mounted on a 4-layer JEDEC test board with 2 thermal vias connecting from the thermal
land to the first buried plane. The 4-layer PCB (2S2P) was constructed based on JESD 51-7 specifications
and vias based on JESD 51-5.
Doc ID 023357 Rev 3
25/38
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