STM32L496XX Datasheet, PDF (246/263 Pages) STMicroelectronics – 25 nA Shutdown mode

Package information
STM32L496xx
Table 123. UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array
package mechanical data (continued)
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
e
-
0.500
-
Z
-
0.750
-
ddd
-
0.080
-
eee
-
0.150
-
fff
-
0.050
-
-
0.0197
-
-
0.0295
-
-
0.0031
-
-
0.0059
-
-
0.0020
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 67. UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array
package recommended footprint
'SDG
'VP
8)%*$B$*B)3B9
Table 124. UFBGA132 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
Dpad
0.5 mm
0.280 mm
Dsm
Stencil opening
0.370 mm typ. (depends on the soldermask
registration tolerance)
0.280 mm
Stencil thickness
Pad trace width
Ball diameter
Between 0.100 mm and 0.125 mm
0.100 mm
0.280 mm
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