RHF330 Datasheet, PDF (20/22 Pages) STMicroelectronics – Rad-hard 1 GHz low noise operational amplifier

Package information
9
Package information
RHF330
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 34. Ceramic Flat-8 package mechanical drawing
Table 6.
Ref.
A
b
c
D
E
E2
E3
e
L
Q
S1
N
Ceramic Flat-8 package mechanical data
Dimensions
Millimeters
Min.
Typ.
Max.
Min.
2.24
2.44
2.64
0.088
0.38
0.43
0.48
0.015
0.10
0.13
0.16
0.004
6.35
6.48
6.61
0.250
6.35
6.48
6.61
0.250
4.32
4.45
4.58
0.170
0.88
1.01
1.14
0.035
1.27
3.00
0.66
0.79
0.92
0.026
0.92
1.12
1.32
0.036
08
Inches
Typ.
0.096
0.017
0.005
0.255
0.255
0.175
0.040
0.050
0.118
0.031
0.044
08
Max.
0.104
0.019
0.006
0.260
0.260
0.180
0.045
0.092
0.052
20/22
Doc ID 15576 Rev 3