TDA7571 Datasheet, PDF (19/21 Pages) STMicroelectronics – STPDACsw - Fully digital high efficiency power audio amplifier

TDA7571
5
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 6. HiQUAD-64 mechanical data and package dimensions
DIM.
MIN.
A
A1
0
A2 2.50
A3
0
b 0.22
c 0.23
D 17.00
D1 (1) 13.90
D2 2.65
E 17.00
E1 (1) 13.90
e
E2 2.35
E3 9.30
E4 13.30
F
G
L 0.80
N
S
mm
inch
TYP. MAX. MIN. TYP.
3.15
0.25 0
2.90 0.10
0.10 0
0.38 0.008
0.32 0.009
17.40 0.669
14.00 14.10 0.547 0.551
2.80 2.95 0.104 0.110
17.40 0.669
14.00 14.10 0.547 0.551
0.65
0.025
2.65 0.092
9.50 9.70 0.366 0.374
13.50 13.70 0.523 0.531
0.10
0.004
0.12
0.005
1.10 0.031
10°(max.)
0°(min.), 7˚(max.)
MAX.
0.124
0.010
0.114
0.004
0.015
0.012
0.685
0.555
0.116
0.685
0.555
0.104
0.382
0.539
0.043
(1): "D1" and "E1" do not include mold flash or protusions
- Mold flash or protusions shall not exceed 0.15mm(0.006inch) per side
OUTLINE AND
MECHANICAL DATA
HiQUAD-64
A
53
64
1
N
c
A
b
⊕FM A B
33
e
B
E1 E
E2
A2
BOTTOM VIEW
E3
E3
slug
(bottom side)
21
E4 (slug lenght)
D1
D
Gauge Plane
0.35
S
L
C
A3
SEATING PLANE
GC
COPLANARITY
A1
POQU64ME
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