TDA7571 Datasheet, PDF (18/21 Pages) STMicroelectronics – STPDACsw - Fully digital high efficiency power audio amplifier

Functions, pins and components description
TDA7571
4.9
Components with critical placement and type
● Ci-L1, Ci-L2, Ci-R1, Ci-R2 must be placed as near as possible to the sources of the
respective power MOS. If 2 power MOS in parallel are needed, can be useful to place a
couple of capacitors for each couple of power MOS. These capacitors are needed to
absorb the high di/dt current present during the Pchannel/Nchannel and
Nchannel/Pchannel transition that can cause high peak voltages on the power supply
wiring connection due to their parasitic inductance.
● The capacitors placed between +Vs to GND and to -Vs are distributed along the power
lines. With P.C. board with very short connections, some of these capacitors can be
avoided (Cvs-1, Cvs-2, Cd3, Cd4, Cd8, Cd7).
● The current sensing resistors Rsens-N-L, Rsens-P-L, Rsens-P-R and Rsens-N-R must
be not inductive components, as example, made by a constant an wire.
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