RHFAC191D03V Datasheet, PDF (16/29 Pages) STMicroelectronics – Rad-hard advanced high-speed 5 V CMOS logic series

Package mechanical data
Figure 7. Ceramic DIL-20 package outline
54ACxxxx, 54ACTxxxx
Note:
16/29
GAMS1904131055CB
The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the
package. Connecting unused pins or metal lid to ground or to the power supply will not
affect the electrical characteristics.
Table 11. Ceramic DIL-20 package mechanical data
Symbol
Dimensions (mm)
Min.
Typ.
Max.
Dimensions (inches)
Min.
Typ.
Max.
A
2.1
2.72
0.083
0.107
a1
3
3.7
0.118
0.146
a2
0.63
0.88
1.14
0.025
0.035
0.045
B
1.93
2.03
2.23
0.076
0.080
0.088
b
0.4
0.45
0.5
0.016
0.018
0.020
b1
0.2
0.254
0.3
0.008
0.010
0.012
D
25.14
25.4
25.65
0.990
1.000
1.010
E
7.36
7.62
7.87
0.290
0.300
0.310
e
2.54
0.100
e1
22.73
22.86
22.99
0.895
0.900
0.905
e2
7.62
7.87
8.12
0.300
0.310
0.320
F
7.29
7.49
7.62
0.287
0.295
0.300
I
3.86
0.152
K
11.3
11.56
0.445
0.455
L
1.14
1.27
1.4
0.045
0.050
0.055
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