RHFAC191D03V Datasheet, PDF (11/29 Pages) STMicroelectronics – Rad-hard advanced high-speed 5 V CMOS logic series

54ACxxxx, 54ACTxxxx
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 2. Ceramic Flat-14 package outline
F
G
D
Note:
H
14
A
1
H
8
N
L
7
E
M
B
C
016029E
The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the
package. Connecting unused pins or metal lid to ground or to the power supply will not
affect the electrical characteristics.
Table 6. Ceramic Flat-14 package mechanical data
Symbol
Dimensions (mm)
Min.
Typ.
Max.
Dimensions (inches)
Min.
Typ.
Max.
A
6.75
6.91
7.06
0.266
0.272
0.278
B
9.76
9.95
10.14
0.384
0.392
0.399
C
1.49
1.95
0.059
0.077
D
0.10
0.127
0.15
0.004
0.005
0.006
E
7.50
7.62
7.75
0.295
0.300
0.305
F
1.27
0.050
G
0.38
0.43
0.48
0.015
0.017
0.019
H
6.0
0.236
L
18.75
22.0
0.738
0.866
M
0.38
0.015
N
4.31
0.170
DocID17352 Rev 4
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