RHFAC191D03V Datasheet, PDF (13/29 Pages) STMicroelectronics – Rad-hard advanced high-speed 5 V CMOS logic series

54ACxxxx, 54ACTxxxx
Figure 4. Ceramic Flat-16 package outline
F
G
Package mechanical data
D
H
16
A
1
H
9
N
L
8
Note:
E
M
B
C
0016030E
The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the
package. Connecting unused pins or metal lid to ground or to the power supply will not
affect the electrical characteristics.
Table 8. Ceramic Flat-16 package mechanical data
Symbol
Dimensions (mm)
Min.
Typ.
Max.
Dimensions (inches)
Min.
Typ.
Max.
A
6.75
6.91
7.06
0.266
0.272
0.278
B
9.76
9.94
10.14
0.384
0.391
0.399
C
1.49
1.95
0.059
0.077
D
0.102
0.127
0.152
0.004
0.005
0.006
E
8.76
8.89
9.01
0.345
0.350
0.355
F
1.27
0.050
G
0.38
0.43
0.48
0.015
0.017
0.019
H
6.0
0.236
L
18.75
22.0
0.738
0.866
M
0.33
0.38
0.43
0.013
0.015
0.017
N
4.31
0.170
DocID17352 Rev 4
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