RHFAC191D03V Datasheet, PDF (15/29 Pages) STMicroelectronics – Rad-hard advanced high-speed 5 V CMOS logic series

54ACxxxx, 54ACTxxxx
Package mechanical data
Figure 6. Ceramic DSCC Flat-20 package outline
H
E
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4
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(

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(

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Note:
6
F
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The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the
package. Connecting unused pins or metal lid to ground or to the power supply will not
affect the electrical characteristics.
Table 10. Ceramic DSCC Flat-20 package mechanical data
Symbol
Dimensions (mm)
Min.
Typ.
Max.
Dimensions (inches)
Min.
Typ.
Max.
A
1.91
b
0.38
2.21
0.075
0.48
0.015
0.087
0.019
c
0.076
0.152
0.003
0.006
D
12.83
13.08
0.505
0.515
E
6.99
7.24
0.275
0.285
E2
5.05
5.21
5.36
0.199
0.205
0.211
E3
0.95
0.037
e
1.14
1.40
0.045
0.055
L
6.35
9.39
0.250
0.370
Q
0.25
0.010
S1
0.55
0.022
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