STBC02 Datasheet, PDF (10/39 Pages) STMicroelectronics – Automatic power path management

Maximum ratings
STBC02
3
Maximum ratings
Symbol
VIN
VLDO
VSYS
VSW
VCHG
VWake-up
VLGC
VISET, VIPRE
VNTC
VBAT, VBATSNS,
VBATSNSFV
VBATMS
ESD
TAMB
TJ
TSTG
Table 3: Absolute maximum ratings
Parameter
Test conditions
Input supply voltage pin
DC voltage
LDO output pin voltage
DC voltage
SYS pin voltage
DC voltage
Switch pin voltage (SW1_I, SW2_I,
SW1_OA,SW1_OB, SW2_OA,
DC voltage
SW2_OB)
CHG pin voltage
DC voltage
WAKE-UP pin voltage
DC voltage
Voltage on logic pins (CEN,
SW_SEL, RESET_NOW,
nRESET, RST_PENDING)
DC voltage
Voltage on ISET, IPRE pins
DC voltage
Voltage on NTC pin
DC voltage
Voltage on BAT, BATSNS and
BATSNSFV pins
DC voltage
Voltage on BATMS pin
DC voltage
Human body model (IN, SYS,
WAKE-UP, LDO, BAT, BATSNS,
BATSNSFV)
JS-001-2012 vs.
AGND PGND and
GND
Human body model (all the others) JS-001-2012
Operating ambient temperature
Maximum junction temperature
Storage temperature
Value
-0.3 to +16.0
-0.3 to +4.0
-0.3 to +6.5
-0.3 to +6.5
-0.3 to +6.5
-0.3 to +4.6
-0.3 to +4.0
-0.3 to +2
-0.3 to VLDO
-0.3 to +5.5
-0.3 to VBAT+0.3
±4000
±2000
-40 to +85
+125
-65 to +150
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
Absolute maximum ratings are those values beyond which damage to the device
may occur. Functional operation under these conditions is not implied.
Symbol
RTHJB⁽¹⁾
Parameter
Table 4: Thermal data
Flip Chip 30 (2.25x2.59 mm)
Junction-to-pcb board thermal resistance
50
Notes:
(1) _{Standard FR4 pcb board.}
Unit
°C/W
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