DALC208SC6Y Datasheet, PDF (10/12 Pages) STMicroelectronics – Automotive low capacitance diode array for ESD protection

Recommendation on PCB assembly
DALC208SC6Y
4.4
Reflow profile
Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
0
30
60
90
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
120 150 180 210 240 270 300
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
10/12
Doc ID 16362 Rev 1