AN977 Datasheet, PDF (1/17 Pages) STMicroelectronics – GUIDELINES FOR UPGRADING FROM THE ST92F120

AN977
APPLICATION NOTE
GUIDELINES FOR UPGRADING FROM THE ST92F120
(0.50 µm) TO THE ST92F124/F150/F250 (0.35 µm)
by Microcontroller Division Applications
INTRODUCTION
Microcontrollers for embedded applications tend to integrate more and more peripherals as
well as larger memories. Providing the right products with the right features such as Flash, em-
ulated EEPROM and a wide range of peripherals at the right cost is always a challenge. That
is why it is mandatory to shrink the microcontroller die size regularly as soon as the technology
will allow it. This major step applies to the ST92F120.
The purpose of this document is to present the differences between the ST92F120 microcon-
troller in 0.50 micron technology versus the ST92F124/F150/F250 in 0.35 micron technology.
It provides some guidelines for upgrading applications for both its software and hardware as-
pects.
In the first part of this document, the differences between the ST92F120 and ST92F124/F150/
F250 devices are listed. In the second part, the modifications required for the application hard-
ware and software are described.
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