S29AS008J Datasheet, PDF (53/55 Pages) SPANSION – 8 Megabit (1M x 8-Bit / 512K x 16-Bit) CMOS 1.8 Volt-Only Boot Sector Flash Memory

Data Sheet
21.2 VBK048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 8.15 mm x 6.15 mm
0.10 (4X)
D
A
D1
PIN A1
CORNER
INDEX MARK
10
TOP VIEW
A
A1
SEATING PLANE
SIDE VIEW
E
B
A2
6
5
e
4
3
2
H
GF
E
D
C
B
1
A
6
φb
φ 0.08 M C
φ 0.15 M C A B
SD 7
0.10 C
BOTTOM VIEW
C
0.08 C
7
SE _E1
A1 CORNER
PACKAGE
JEDEC
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
N
φb
e
SD / SE
VBK 048
N/A
8.15 mm x 6.15 mm NOM
PACKAGE
MIN
NOM
MAX
---
---
1.00
0.18
---
---
0.62
---
0.76
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
8
6
48
0.35
---
0.43
0.80 BSC.
0.40 BSC.
---
NOTE
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3338 \ 16-038.25b
November 9, 2011 S29AS008J_00_09
S29AS008J
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