SKY66109_11 Datasheet, PDF (7/14 Pages) Skyworks Solutions Inc. – Integrated PA with up to plus 22.5 dBm output power

DATA SHEET • SKY66109-11: ZIGBEE/SMART ENERGY FEM
Evaluation Board Description
The SKY66109-11 Evaluation Board is used to test the
performance of the SKY66109-11 FEM. The board is optimized for
evaluation, experimentation, and investigation with an 802.15.4
signal source. The design and layout can be quickly and easily
transferred into a production design.
An Evaluation Board schematic diagram is provided in Figure 4. A
reference design schematic is provided in Figure 5. Table 8
describes the pins on the power and control I/O header (J5).
Table 9 provides the Bill of Materials (BOM) list for Evaluation
Board components. The Evaluation Board is shown in Figure 6.
Evaluation Board Setup Procedure
1. Connect J1, J2, J3, and J4 to 50 Ω instruments.
Terminate all unused ports (if applicable) with 50 Ω.
2. Connect the supply ground to pins 19 and 20 of J5.
3. Connect 3.0 V to pins 15 and 16 of J5.
4. Connect 3.0 V to pins 3 and 4 of J5.
NOTE: Pins 7 and 8 of J5 are left open.
NOTE: By following the logic in Table 6, the required RF path is
selected. Refer to Table 7 for antenna port control.
5. Monitor the 2.5 GHz amplifier transmit performance by
applying an RF signal to J3 and monitoring the output power on
J1 (ANT1) or J2 (ANT2).
CAUTION: Care should be taken not to overdrive the amplifier by
applying too much RF on the input to the device. A
suitable starting input power would be –20 dBm.
6. Monitor the 2.5 GHz amplifier receive performance by applying
an RF signal to J1 (ANT1) or J2 (ANT2) and monitoring the
output signal on J3.
Package Dimensions
The PCB layout footprint for the SKY66109-11 is provided in
Figure 7. Typical part markings are shown in Figure 8. Package
dimensions for the 20-pin MCM are shown in Figure 9, and tape
and reel dimensions are provided in Figure 10.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY66109-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 240 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
203034F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 13, 2015
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