SKY66109_11 Datasheet, PDF (11/14 Pages) Skyworks Solutions Inc. – Integrated PA with up to plus 22.5 dBm output power

DATA SHEET • SKY66109-11: ZIGBEE/SMART ENERGY FEM
Stencil aperture size for
center ground pad should be
80% to 100% (by area) of the
solder mask opening
0.5 mm Pitch
Package Outline
Pin 20
Pin 1 Indicator
0.20 X 45°
Pin 1
4.3 mm
20X 0.56 mm
20X 0.25 mm
3.3 mm
4X 0.59 mm
2X 0.4375 mm
2X 0.513 mm
Stencil Aperture
Top View
4.3 mm
14X 0.56 mm
14X 0.25 mm
4.4 mm
2.1045 mm
20X 0.66 mm
20X 0.35 mm
0.5 mm Pitch
Package Outline
3.3 mm
0.5 mm Pitch
Package Outline
Pin 20
Thermal via array Ø0.3 mm on 0.6 mm
pitch improves thermal performance
Pin 1
Note:
Metallization
Top View
Pin 20
Pin 1 Indicator
0.20 X 45°
Pin 1
Thermal vias should be resin filled and capped in accordance with
IPC-4761 Type VII vias. Recommended Cu thickness is 30 to 35 µm.
Figure 7. PCB Layout Footprint
3.4 mm
2X 0.59 mm
Opening size of 60% to 100%
of exposed center opening shown
Solder Mask Opening
Top View
Y0317
Pin 1
Indicator
Line 1
Line 2
Line 3
NOTE:
Lines 1, 2, and 3 have a maximum of 7 characters
Line 1 = Part Number and Version
Line 2 = Lot Number
Line 3 = YEAR-WEEK-Country Code (MX)
Figure 8. Typical Part Markings
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
203034F • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 13, 2015
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