SLWSTK6101B Datasheet, PDF (75/84 Pages) Silicon Laboratories – BGM113 Blue Gecko Bluetooth ® Module Data Sheet

10. Soldering Recommendations
BGM113 Blue Gecko Bluetooth ^® Module Data Sheet
Soldering Recommendations
10.1 Soldering Recommendations
This section describes the soldering recommendations regarding BGM113 Module.
BGM113 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal
mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.
• Refer to technical documentations of particular solder paste for profile configurations.
• Avoid usining more than two reflow cycles.
• Aperture size of the stencil should be 1:1 with the pad size.
• A no-clean, type-3 solder paste is recommended.
• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.
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