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ISL12024IRTC Datasheet, PDF (5/24 Pages) Intersil Corporation – Real-Time Clock/Calendar
ISL12024IRTC
AC Electrical Specifications (Continued)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
MAX
(Note 12) TYP (Note 12) UNITS NOTES
Cpin SDA and SCL Pin Capacitance
10
pF 9, 11
tWC Non-Volatile Write Cycle Time
tR
SDA and SCL Rise Time
From 30% to 70% of VDD
tF
SDA and SCL Fall Time
From 70% to 30% of VDD
Cb Capacitive Loading of SDA or SCL Total on-chip and off-chip.
12
20
20+0.1xCb
300
20+0.1xCb
300
10
400
ms
10
ns 9, 11
ns 9, 11
pF 9, 11
RPU SDA and SCL Bus Pull-up Resistor Maximum is determined by tR and tF.
1
Off-chip
For Cb = 400pF, max is about 2kΩ~2.5kΩ.
For Cb = 40pF, max is about 15kΩ~20kΩ
kΩ 9, 11
NOTES:
3. IRQ/FOUT Inactive.
4. VIL = VDD x 0.1, VIH = VDD x 0.9, fSCL = 400kHz
5. VDD > VBAT +VBATHYS
6. Bit BSW = 0 (Standard Mode), ATR = 00h, VBAT ≥1.8V
7. Specified at +25°C.
8. In order to ensure proper timekeeping, the VDD SR- specification must be followed.
9. Limits established by characterization and are not production tested.
10. tWC is the minimum cycle time to be allowed for any non-volatile Write by the user (it is the time from valid STOP condition at the end of Write
sequence of a serial interface Write operation) to the end of the self-timed internal non-volatile write cycle.
11. These are I2C specific parameters and are not directly tested, however they are used during device testing to validate device specification.
12. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
Timing Diagrams
Bus Timing
SCL
tSU:STA
SDA
(INPUT TIMING)
SDA
(OUTPUT TIMING)
tF
tHIGH
tSU:DAT
tHD:STA
tLOW
tR
tHD:DAT
tAA
tDH
tHD:STO
tSU:STO
tBUF
Write Cycle Timing
SCL
SDA
8TH BIT OF LAST BYTE
ACK
tWC
STOP
CONDITION
START
CONDITION
5
FN6749.1
December 15, 2011