SI7015-A20 Datasheet, PDF (16/39 Pages) Silicon Laboratories – DIGITAL IC HUMIDITY AND TEMPERATURE SENSOR

Si7015-A20
4.6.3. Rework
To maintain the specified sensor performance, care must be taken during rework to minimize the exposure of the
device to excessive heat and to avoid damage/contamination or a shift in the sensor reading due to liquids, solder
flux, etc. Manual touch-up using a soldering iron is permissible under the following guidelines:
The exposed polymer sensing film must be kept clean and undamaged. A protective cover is
recommended during any rework operation (Kapton^® tape or the factory-installed cover).
Flux must not be allowed to contaminate the sensor; liquid flux is not recommended even with a cover in
place. Conventional lead-free solder with rosin core is acceptable for touch-up as long as a cover is in
place during the rework.
If possible, avoid water or solvent rinses after touch-up. Cleaning after soldering is possible, but must be
done carefully to avoid impacting the performance of the sensor. See application note, “AN607: Si70xx
Humidity Sensor Designer’s Guide” for more information on cleaning.
Minimize the heating of the device. Soldering iron temperature should not exceed 350 °C and the contact
time per pin should not exceed five seconds.
Hot air rework is not recommended. If a device must be replaced, remove the device by hot air and solder
a new part in its place by reflow following the guidelines above.
*Note: All trademarks are the property of their respective owners.
Figure 7. Si7015 with Factory-Installed Protective Cover
16
Rev. 1.0