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SI824X Datasheet, PDF (11/30 Pages) Silicon Laboratories – CLASS D AUDIO DRIVER WITH PRECISION DEAD-TIME GENERATOR
Si824x
Table 7. Thermal Characteristics
Parameter
IC Junction-to-Air
Thermal Resistance
Symbol
JA
NB
SOIC-16
105
Unit
°C/W
60
50
40
VDDI = 5.5 V
VDDA, VDDB = 24 V
30
20
10
0
0
50
100
150
200
Case Temperature (ºC)
Figure 5. NB SOIC-16, Thermal Derating Curve, Dependence of Safety Limiting Values with Case
Temperature per DIN EN 60747-5-2
Table 8. Absolute Maximum Ratings1
Parameter
Storage Temperature2
Ambient Temperature under Bias
Input-side Supply Voltage
Symbol
TSTG
TA
VDDI
Min
Typ
–65
—
–40
—
–0.6
—
Max
+150
+125
6.0
Units
°C
°C
V
Driver-side Supply Voltage
VDDA, VDDB –0.6
—
30
V
Voltage on any Pin with respect to Ground
VIN
–0.5
—
VDD + 0.5
V
Output Drive Current per Channel
Lead Solder Temperature (10 sec)
Latchup Immunity3
IO
—
—
10
mA
—
—
260
°C
—
—
100
V/ns
Maximum Isolation (Input to Output)
Maximum Isolation (Output to Output)
—
—
—
—
2500
1500
VRMS
VRMS
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. VDE certifies storage temperature from –40 to 150 °C.
3. Latchup immunity specification is for slew rate applied across GNDI and GNDA or GNDB.
Rev. 1.0
11