S-13D1 Datasheet, PDF (10/45 Pages) Seiko Instruments Inc – SUPER-SMALL PACKAGE 2-CIRCUIT BUILT-IN DELAY FUNCTION HIGH RIPPLE-REJECTION LOW DROPOUT CMOS VOLTAGE REGULATOR

SUPER-SMALL PACKAGE 2-CIRCUIT BUILT-IN DELAY FUNCTION HIGH RIPPLE-REJECTION LOW DROPOUT CMOS VOLTAGE REGULATOR
S-13D1 Series
Rev.1.3_01
Power Dissipation of HSNT-6 (1212) (Reference)
Power dissipation of package differs depending on the mounting conditions.
Consider the power dissipation characteristics under the following conditions as reference.
[Mounted board]
(1) Board size:
(2) Board material:
(3) Wiring ratio:
(4) Test conditions:
(5) Land pattern:
40 mm × 40 mm × t0.8 mm
Glass epoxy resin (four layers)
50%
When mounted on board (wind speed: 0 m/s)
Refer to the recommended land pattern (drawing code: PM006-A-L-SD)
1200
1000
800
600
400
200
0
0
50
100
150
Ambient Temperature (Ta) [°C]
Figure 10 Power Dissipation of Package (When Mounted on Board)
Condition
HSNT-6 (1212) (When mounted on board)
Table 9
Power Dissipation (Reference)
1000 mW
Thermal Resistance Value (θj−a)
100°C/W
10