HYB5118160BSJ-50- Datasheet, PDF (24/24 Pages) Siemens Semiconductor Group – 1M x 16-Bit Dynamic RAM 1k Refresh

Plastic Package P-TSOPII-50/44-1 (400 mil) (SMD)
(Plastic Thin Small Outline Package (Type II))
15˚±5˚
0.8
0.4
+0.05
-0.1
3)
15˚±5˚
24x 0.8 = 19.2
0.1 50x
0.2 M 50x
50
40 36
26
HYB 5118160BSJ-50/-60
HYB 3118160BSJ-50/-60
1M × 16 DRAM
10.16±0.13 ²⁾
0.5 ±0.1
11.76 ±0.2
1
11 15
25
2.5 max
20.95 ±0.13 ¹⁾
Index Marking
1) _{Does not include plastic or metal protrusion of 0.15 max per side}
2) _{Does not include plastic protrusion of 0.25 max per side}
3) _{Does not include dambar protrusion of 0.13 max per side}
GPX05958
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.
SMD = Surface Mounted Device
Semiconductor Group
24
Dimensions in mm
1998-10-01