GP1USC31XP Datasheet, PDF (8/13 Pages) Sharp Electrionic Components – Infrared Detector for Remote Control

Preliminary
GP1USC3xXP Series
● Soldering Instructions
1. Sharp recommends soldering this part no more than twice and at the profile shown in Fig. 6. Reflow should occur
within three days, after storing at 10°C to 30°C, and at no more than 70% relative humidity.
2. When preheating this part with infrared, localized high temperatures can be generated in the resin of this part;
therefore the process should be confirmed that it remains within the limits shown in Fig. 6.
3. When hand soldering, use a temperature-controlled iron with the point < 350°C < 5 seconds.
4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the
device due to the PCB flexing during the soldering process.
5. Sharp recommends handling this part in a static-controlled work area.
Fig. 6. Soldering Profile
255°C MAX.
230°C
180°C
150°C
1 - 3°C/s
1 - 5°C/s
1 - 3°C/s
25°C
GP1USC3XP-8
90 ±30 s
40 s MAX.
● Soldering Mask
Fig. 7 shows the recommended solder mask for this device.
Fig. 7. Soldering Mask
2.0
1.7
2.0
GND
GND
V_OUT
V_CC
GP1USC3XP-13
2.0
0.7
2.0
5.7
8
Sheet No.: OP08905
July, 2009