GP1USC31XP Datasheet, PDF (6/13 Pages) Sharp Electrionic Components – Infrared Detector for Remote Control

Preliminary
GP1USC3xXP Series
■ Design Considerations
Design Guidelines
1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
2. Avoid placing mechanical stress upon this part, whether to the case or terminals. Such stresses may crack the
molding material, possibly breaking internal wire bonds in the part.
3. Conductive thermoplastics are used in the second mold resin of this part. Do not allow this resin to come in con-
tact with the PCB landing or any circuit runs.
4. When using this part in a remote control detector, the incoming signal must be managed so that Tdata is less
than 100 ms and Toff (suspend time) is more than 25 ms; and the minimum pulse width of modulated IR data
is 250 µs during Ton. Should the signal format fail to meet these conditions, the reception distance or device
output may be compromised. See Fig. 4.
Fig. 4. Transmit Time for One Signal Block
Transmitting time for 1 block: T
Data Period: Tdata
Suspendx Period: T_OFF
T_ON
...
...
GP1USC3XP-2
5. Output noise may be caused by environmental factors, even in the absence of a received signal. If the device
is used in the presence of strong external light, this may show up as noise in the detector. Sharp recommends
checking the layout and structure so as to reduce the amount of external light interference. Also, confirm the
device’s performance in actual operation, as the output may be affected by signal format, temperature, and the
distance from the transmitter.
6. This device may have degraded optical performance if the detector surface becomes dirty or coated with any
foreign substance. This may happen through the use of process chemicals, including washing; it is for this rea-
son that Sharp does not recommend washing this part. If the detector surface becomes contaminated, use a
soft cloth to wipe it clean.
7. Sharp recommends a circuit similar to the one shown in Fig. 5 to accompany this device. The values should be
adjusted to reflect the actual circuit conditions, and be placed as physically close to the device as possible.
Fig. 5. Device Connection
V_CC
GND
R₁
+
C₁
Ve
GND
V_OUT
V_O
NOTES:
R₁ = 47 Ω ±5%
C₁ = 47 µF
GP1USC3XP-3
Sheet No.: OP08905
July, 2009
6