GP1USC31XP Datasheet, PDF (7/13 Pages) Sharp Electrionic Components – Infrared Detector for Remote Control

Preliminary
GP1USC3xXP Series
8. This device has a parallel transistor internally to protect it against static. However, the internal protection should
not be counted upon to protect the device against overvoltage or noise spikes in the power supply, as the transistor
could experience a secondary breakdown short. Sharp recommends decoupling the power supply near the device
with a 47  (1/10 W) resistor and 10 µF capacitor.
9. This part is not highly tolerant of condensing conditions. Condensation can degrade the case and lead connec-
tions, leading to degraded electrical characteristics.
■ Manufacturing Guidelines
● Storage and Handling
1. Moisture-proofing: These parts are shipped in vacuum-sealed packaging to keep them dry and ready for use.
2. Store these parts between 10°C and 30°C, at a relative humidity of less than 70%, for up to a year.
3. After breaking the package seal, maintain the environment within 10°C to 30°C, at a relative humidity of less
than 70%. Mount the parts within 2 days.
4. If the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant.
Store them as above, but since the seal has been broken, the parts must be used within 4 weeks.
5. If the parts are exposed to air for more than 3 days, if there are more than 3 days between reflow operations, or
if the silica gel telltale indicates moisture contamination, bake the parts. If these parts will undergo a second
reflow operation, and if they have exceeded the open time as noted above, they must be baked.
In all cases, these parts may be baked only once:
• When in the tape carrier, bake them at a temperature of 65°C for 48 hours. Bake only one reel at a time; reels
will become deformed if stacked.
• When loose on a metal tray or on a PCB, bake them at a temperature of 100°C to 110°C, for 12 to 24 hours.
Temporary mounting on a PCB must be using an adhesive and not by soldering.
Baking these particular parts in the reels is to be avoided if at all possible. To properly bake these parts, they
should be mounted to a PCB with adhesive (not soldered) or placed in a metal tray.
Sheet No.: OP08905
July, 2009
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