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| C9WT803 Datasheet, PDF (7/19 Pages) Seoul Semiconductor – White colored SMT package Pb-free Reflow Soldering Application | |||
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5. Reliability Test
Item
Reference
Thermal Shock
High Temperature
Storage
High Temp. High
Humidity Storage
Low Temperature
Storage
Operating
Endurance Test
High Temperature
High Humidity Life
Test
High Temperature
Life Test
Low Temperature
Life Test
ESD(HBM)
Reflow
EIAJ
ED-4701
EIAJ
ED-4701
EIAJ
ED-4701
EIAJ
ED-4701
Internal
Reference
Internal
Reference
Internal
Reference
Internal
Reference
MIL-STD-
883D
Tsol
Test Conditions
Ta =-40oC(30min) ~
100oC(30min)
Ta =100oC
Ta =60oC, RH=90%
Ta =-40oC
Ta =25oC, IF =20mA
Duration /
Cycle
Number
of
Damaged
100 Cycle
0/22
1000 Hours
0/22
1000 Hours
0/22
1000 Hours
0/22
1000 Hours
0/22
Ta =60oC, RH=90%, IF =20mA
500 Hours
0/22
Ta =85oC, IF =20mA
Ta =-40oC, IF =20mA
1KV at 1.5kâ¦; 100pF
260â< 10sec. Reflow
Soldering
500 Hours
1000 Hours
3 Time
3 Time
0/22
0/22
0/22
0/22
â¡ CRITERIA FOR JUDGING THE DAMAGE
Item
Symbol
Condition
Forward Voltage
VF
Luminous Intensity
IV
IF =20mA
IF =20mA
Note : [1] USL : Upper Standard Level
[2] LSL : Lower Standard Level
Criteria for Judgment
MIN
MAX
-
USL [1] Ã 1.2
LSL [2] Ã 0.7
-
Rev.03
March 2011
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)
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