C9WT803 Datasheet, PDF (4/19 Pages) Seoul Semiconductor – White colored SMT package Pb-free Reflow Soldering Application

2. Absolute maximum ratings ^[1]
Parameter
Power Dissipation
Forward Current
Operating Temperature
Storage Temperature
Junction Temperature
Symbol
P_d
I_F
T_opr
T_stg
Tj
Value
111
30
-40~+85
-40~+100
125
Unit
mW
mA
℃
℃
℃
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
* LED’s properties might be different from suggested values like above and below tables if operation condition
will be exceeded our parameter range.
3. Electro-Optical characteristics
Parameter
Forward Voltage
Reverse Voltage
Luminous Intensity*^[1]
(4,700~7,000 K)
Color Correlated Temperature
Viewing Angle ^[2]
Color Rendering Index*
ESD (HBM)
Thermal resistance ^[3]
Symbol
V_F
I_R
I_v
CCT
2Θ_1/2
Ra
RthJS
Condition
I_F=20mA
V_F=5V
I_F=20mA
I_F=20mA
I_F=20mA
I_F=20mA
1.5kΩ;100pF
I_F=20mA
Min.
2.9
-
1,000
2,600
-
90
1
Typ.
3.2
-
-
-
115
-
-
76
Max.
3.4
10
2,000
7,000
-
-
-
Unit
V
μA
Mcd
K
deg.
-
KV
ºC/W
[1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package.
[2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[3] Thermal resistance: RthJS (Junction / solder)
* Tolerance : VF :±0.1V, IV :±10%, Ra :±3, x,y :±0.01
[Note] All measurements were made under the standardized environment of SSC.
Rev.03
March 2011
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)