C9WT803 Datasheet, PDF (18/19 Pages) Seoul Semiconductor – White colored SMT package Pb-free Reflow Soldering Application

12. Precaution for use
1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator)
with a desiccant. Otherwise, to store them in the following environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light
transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
3) In the case of more than 1 week passed after opening or change color of indicator on desiccant,
components shall be dried 10-12hr. at 60±5ºC.
4) Silver plating might be tarnished in the environment that contains corrosive gases and materials.
Also any product that has tarnished lead might be decreased the solder-ability and optical-electrical
properties compare to normal ones.
Please do not expose the product in the corrosive environment during the storage.
5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temperature after soldering.
6) Quick cooling shall be avoided.
7) Components shall not be mounted on warped direction of PCB.
8) Anti radioactive ray design is not considered for the products.
9) This device should not be used in any type of fluid such as water, oil, organic solvent etc.
When washing is required, IPA should be used.
10) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
11) The LEDs must be soldered within seven days after opening the moisture-proof packing.
12) Repack unused products with anti-moisture packing, fold to close any opening and then store
in a dry place.
13) The appearance and specifications of the product may be modified for improvement without notice.
Rev.03
March 2011
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)