C9WT803 Datasheet, PDF (17/19 Pages) Seoul Semiconductor – White colored SMT package Pb-free Reflow Soldering Application

11. Soldering
(1) Lead Solder
Lead Solder
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time Condition 10 sec. Max.
2.5~5 C / sec.
Lead Solder
2.5~5o C / sec.
240 ^oC Max.
10 sec. Max.
Pre-heating
120~150 ^oC
60sec. Max.
Above 200 ^oC
120sec. Max.
(2) Lead-Free Solder
Pre-heat
Lead Free Solder
150~200℃
Pre-heat time
Peak-Temperature
120 sec. Max.
260℃ Max.
Soldering time Condition 10 sec. Max.
1~5 ^oC / sec.
Lead-free Solder
1~5 ^oC / sec.
260 ^oC Max.
10 sec. Max.
Pre-heating
150~200 ^oC
60sec. Max.
Above 220 ^oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter,
the picking up nozzle that does not affect the silicone resign should be used.
(5) It is recommended that the customer use the nitrogen reflow method.
(6) Repairing should not be done after the LEDs have been soldered.
(7) Reflow soldering should not be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be
damaged.
[Note] In case that the soldered products are reused in soldering process, we don’t guarantee the_Rp_ero_vd_.0uc₃ts.
March 2011
www.seoulsemicon.com
SSC-QP-7-07-24 (Rev.00)