THBTGFR5210-CE Datasheet, PDF (6/15 Pages) Seoul Semiconductor – Surface-mounted chip LED device

3.Outline Dimension
3
2
4
3.0
[Top view]
1
R0.3
0.4
Marking
( Tolerance: ±0.1, Unit: mm )
0.5
0.85
1.35
[Side view]
2.2
2.0
Resin
0.47
1
2
3
4
0.4
0.42
[Bottom view]
PCB
[Inner Circuit Diagram]
1.4
0.3
4
1
2
3
Anode
Common
* MATERIALS
PARTS
Package
Encapsulating Resin
Electrodes
2.0
3.8
[Recommended Solder Pattern]
MATERIALS
BT_Resin
Epoxy
Au Plating Copper Alloy
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)