THBTGFR5210-CE Datasheet, PDF (12/15 Pages) Seoul Semiconductor – Surface-mounted chip LED device

6. Packing
1.5
+0.1
-0
4.0 ^±0.1
2.0 ^±0.05
0.2 ^±0.05
1.1^±0.1
1.5 ^±0.1
180
+0
-3
2a
2 ^±0.2
22
13 ^±0.2
1.2 ^±0.1
11.4
9 ^±0.3
Label
Tolerance: ±0.2, Unit: ㎜
(1) Quantity:3,000pcs./Reel
(2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is
turned off from the carrier tape at10˚angle to be the carrier tape.
(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package.
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)