SAW8KG0B Datasheet, PDF (28/31 Pages) Seoul Semiconductor – Superior high Flux for High Voltage System

Handling of Silicone Resin for LEDs
Product Data Sheet
MJT 5630-Acrich MJT
(1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects
of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone
sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick
and place nozzle, except that mechanical pressure on the surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be
considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer,
and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable
cleaning solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that
these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with
acid or sulfur material in sealed space.
(7) Avoid leaving fingerprints on silicone resin parts.
Rev7.0
28
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