SAW8KG0B Datasheet, PDF (27/31 Pages) Seoul Semiconductor – Superior high Flux for High Voltage System

Reflow Soldering Characteristics
Product Data Sheet
MJT 5630-Acrich MJT
Table 8.
Profile Feature
Average ramp-up rate (Tsmax to Tp)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)2
Ramp-down Rate
Time 25°C to Peak Temperature
IPC/JEDEC J-STD-020
Sn-Pb Eutectic Assembly
3° C/second max.
100 °C
150 °C
60-120 seconds
183 °C
60-150 seconds
215℃
10-30 seconds
6 °C/second max.
6 minutes max.
Pb-Free Assembly
3° C/second max.
150 °C
200 °C
60-180 seconds
217 °C
60-150 seconds
260℃
20-40 seconds
6 °C/second max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
Rev7.0
27
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