LUYT801-S Datasheet, PDF (12/13 Pages) Seoul Semiconductor – Industry Standard PLCC SMT package

10. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop.
Attention in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 4 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Silver plating might be tarnished in the environment that contains corrosive gases
and materials. Also any product that has tarnished lead might be decreased the
solder-ability and optical-electrical properties compare to normal ones.
Please do not expose the product in the corrosive environment during the storage.
(5) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(6) Quick cooling shall be avoided.
(7) Components shall not be mounted on warped direction of PCB.
(8) Anti radioactive ray design is not considered for the products.
(9) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(10) When the LEDs are illuminating, operating current should be decided after considering
the ambient maximum temperature.
(11) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and then
store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
Rev. 00
September. 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)