LUYT801-S Datasheet, PDF (11/13 Pages) Seoul Semiconductor – Industry Standard PLCC SMT package

9. soldering
(1) Lead Solder
-FBE
4PMEFS
1SFIFBU
_℃
1SFIFBU
UJNF

TFD
.BY
1FBL5FNQFSBUVSF
℃ .BY
4PMEFSJOH
UJNF

$POEJUJPO

TFD
.BY
2.5~5 C / sec.
Lead Solder
2.5~5o C / sec.
240 ^oC Max.
10 sec. Max.
Pre-heating
120~150 ^oC
60sec. Max.
Above 200 ^oC
120sec. Max.
(2) Lead-Free Solder
-FBE
'SFF
4PMEFS
1SFIFBU
_℃
1SFIFBU
UJNF

TFD

.BY
1FBL5FNQFSBUVSF
℃ .BY
4PMEFSJOH
UJNF

$POEJUJPO

TFD
.BY
1~5 ^oC / sec.
Lead-frame Solder
1~5 ^oC / sec.
260 ^oC Max.
10 sec. Max.
Pre-heating
150~200 ^oC
60sec. Max.
Above 220 ^oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated part.
So when using the chip mounter, the picking up nozzle that does not affect the silicone
resign should be used.
(5) It is recommended that the customer use the nitrogen reflow method.
(6) Repairing should not be done after the LEDs have been soldered.
(7) Reflow soldering should not be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
September. 2010
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-24 (Rev.00)