100E016 Datasheet, PDF (7/9 Pages) SEMTECH ELECTRONICS LTD. – 8-Bit Synchronous Binary Up Counter

HIGH-PER.ORMANCE PRODUCTS
Package Information
Y BRK
–N–
D
PIN^–LD^– escriptions
SK10/100E016
B 0.007 (0.180) M T L - M S N S
U
Z
0.007 (0.180) M T L - M S N S
+
W
D
V
28
1
A 0.007 (0.180) M T L – M S N S
Z
R 0.007 (0.180) M T L – M S N S
C
E
G
G1
0.010 (0.250) S T L – M S N S
0.004 (0.100)
J ^{–T– SEATING PLANE}
VIEW S
NOTES:
1. Datums -L-, -M-, and -N- determined where top of lead
shoulder exits plastic body at mold parting line.
2. DIM G1, true position to be measured at Datum -T-,
Seating Plane.
3. DIM R and U do not include mold flash. Allowable
mold flash is 0.010 (0.250) per side.
4. Dimensioning and tolerancing per ANSI Y14.5M,
1982.
5. Controlling Dimension: Inch.
6. The package top may be smaller than the package
bottom by up to 0.012 (0.300). Dimensions R and U
are determined at the outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs,
gate burrs and interlead flash, but including any
mismatch between the top and bottom of the plastic
body.
7. Dimension H does not include Dambar protrusion or
intrusion. The Dambar protrusion(s) shall not cause
the H dimension to be greater than 0.037 (0.940).
The Dambar intrusion(s) shall not cause the H
dimension to be smaller than 0.025 (0.635).
Revision 1/.ebruary 13, 2001
+
X
G1 0.010 (0.250) S T L - M S N S
H
0.007(0.180) M T L – M S N S
K1
K
F 0.007 (0.180) M T L – M ^S N S
INCHES
MILLIMETERS
DIM
MIN
MAX
MIN
MAX
A
0.485 0.495 12.32 12.57
B
0.485 0.495 12.32 12.57
C
0.165 0.180 4.20
4.57
E
0.090 0.110 2.29
2.79
.
0.013 0.019 0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026 0.032 0.66
0.81
J
0.020
--
0.51
--
K
0.025
--
0.64
--
R
0.450 0.456 11.43 11.58
U
0.450 0.456 11.43 11.58
V
0.042 0.048 1.07
1.21
W
0.042 0.048 1.07
1.21
X
0.042 0.056 1.07
1.42
Y
--
0.020
--
0.50
Z
2^o
10^o
2^o
10^o
G1
0.410 0.430 10.42 10.92
K1
0.040
--
1.02
--
7
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