HRLO250N10K Datasheet, PDF (4/7 Pages) SemiHow Co.,Ltd. – High Dense Cell Design

Typical Characteristics (continued)
1.2
1.1
1.0
0.9
0.8
-100
 Note :
1. V = 0 V
GS
2. I_D = 250PA
-50
0
50
100
150
200
T , Junction Temperature [oC]
J
Figure 7. Breakdown Voltage Variation
vs Temperature
10²
Operation in This Area
10¹
is Limited by R _DS(on)
10 us
100 us
10⁰
1 ms
10^-1
* Notes :
1. T_A = 25 ^oC
2. T = 150 oC
J
3. Single Pulse
10 ms
DC
10^-2
10^-2
10^-1
10⁰
10¹
10²
V_DS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
2.5
2.0
1.5
1.0
0.5
0.0
-100
Note :
1. V = 10 V
GS
2. I_D = 7.9 A
-50
0
50
100
150
200
T_J, Junction Temperature [^oC]
Figure 8. On-Resistance Variation
vs Temperature
8
7
6
5
4
3
2
1
0
25
50
75
100
125
150
T_A, Ambient Temperature [^oC]
Figure 10. Maximum Drain Current
vs Case Temperature
Figure 11. Transient Thermal Response Curve
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