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HFC1N80 Datasheet, PDF (2/7 Pages) SemiHow Co.,Ltd. – 800V N-Channel MOSFET
Electrical Characteristics TC=25 °C unless otherwise specified
Symbol
Parameter
Test Conditions
Min
On Characteristics
VGS Gate Threshold Voltage
VDS = VGS, ID = 250 ㎂
2.5
RDS(ON) Static Drain-Source
On-Resistance
VGS = 10 V, ID = 0.3 A
--
Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 ㎂
800
ΔBVDSS Breakdown Voltage Temperature
/ΔTJ Coefficient
ID = 250 ㎂, Referenced to25℃
--
IDSS Zero Gate Voltage Drain Current VDS = 800 V, VGS = 0 V
--
VDS = 640 V, TC = 125℃
--
IGSSF Gate-Body Leakage Current,
Forward
VGS = 30 V, VDS = 0 V
--
IGSSR Gate-Body Leakage Current,
Reverse
VGS = -30 V, VDS = 0 V
--
Dynamic Characteristics
Ciss Input Capacitance
--
Coss Output Capacitance
VDS = 25 V, VGS = 0 V,
--
f = 1.0 MHz
Crss Reverse Transfer Capacitance
--
Switching Characteristics
td(on) Turn-On Time
tr Turn-On Rise Time
td(off) Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg Total Gate Charge
Qgs Gate-Source Charge
Qgd Gate-Drain Charge
VDS = 400 V, ID = 1.0 A,
--
RG = 25 Ω
--
--
(Note 4,5)
--
VDS = 640 V, ID = 1.0 A,
--
VGS = 10 V
--
(Note 4,5)
--
Source-Drain Diode Maximum Ratings and Characteristics
IS Continuous Source-Drain Diode Forward Current
--
ISM Pulsed Source-Drain Diode Forward Current
--
VSD Source-Drain Diode Forward Voltage IS = 0.6 A, VGS = 0 V
--
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
IS = 1.0 A, VGS = 0 V
--
diF/dt = 100 A/μs (Note 4)
--
Typ Max Units
--
4.5
V
13 16
Ω
--
--
V
1.0
-- V/℃
--
1
㎂
--
10
㎂
-- 100 ㎁
-- -100 ㎁
150 195 ㎊
20
26
㎊
5.5 7.2 ㎊
12
30
㎱
40
90
㎱
25
60
㎱
45 100 ㎱
7.5 10.0 nC
1.2
--
nC
4.5
--
nC
-- 0.6
A
-- 2.4
--
1.4
V
310 --
㎱
0.8
--
μC
Notes ;
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L=170mH, IAS=1.0A, VDD=50V, RG=25Ω, Starting TJ =25°C
3. ISD≤0.6A, di/dt≤200A/μs, VDD≤BVDSS , Starting TJ =25 °C
4. Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature
◎ SEMIHOW REV.A0,Jan 2007