LC88F58B0A Datasheet, PDF (13/25 Pages) Sanyo Semicon Device – FROM 128K byte, RAM 4096K byte on-chip 16-bit 1-chip Microcontroller

LC88F83B0A
Absolute Maximum Ratings at Ta = 25°C, VSS = LCDVSS0 = LCDVSS1 = 0V
Parameter
Maximum supply
voltage
Symbol
VDD max
Pin/Remarks
VDD
Conditions
VDD
VDD[V]
Specification
min
typ
max
unit
-0.3
+6.5
LCD supply
voltage
VLCD max VLCD2 to VLCD4
VDD
-0.3
+6.5
LCD maximum
supply voltage
LCD max
SEG0 to SEG71
COM0 to COM15
VDD, VLCD4
V
-0.3
+6.5
Input voltage
Input/output
voltage
VI(1)
VIO(1)
RESB, XT1, CF1
PORT 0, 1, 2
SEG71 to SEG56
-0.3
VDD+0.3
-0.3
VDD+0.3
Peak output
IOPH(1)
PORT0, 2
CMOS output selected
-5
current
Current at each pin
IOPH(2)
PORT1
CMOS output selected
-14
Current at each pin
Mean output
IOMH(1)
PORT0, 2
CMOS output selected
-3
current
Current at each pin
(Note 1-1)
IOMH(2)
PORT1
CMOS output selected
-9
Current at each pin
Total output
ΣIOAH(1)
PORT0, 2
Total of all pins
22.5
current
ΣIOAH(2)
PORT1
Total of all pins
25
Peak output
current
ΣIOAH(3)
IOPL(1)
IOPL(2)
PORT 0, 1, 2
PORT0, 2
PORT1
Total of all pins
Current at each pin
Current at each pin
47.5
mA
13
17
Mean output
IOML(1)
PORT0, 2
Current at each pin
7.5
current
(Note 1-1)
IOML(2)
PORT1
Current at each pin
10.5
Total output
ΣIOAL(1)
PORT0, 2
Total of all pins
35
current
ΣIOAL(2)
PORT1
Total of all pins
60
ΣIOAL(3)
PORT 0, 1, 2
Total of all pins
80
Allowable power
Pd max
TQFP120(14×14)
Ta=-20 to +75°C
dissipation
Operating ambient Topg
temperature
Storage ambient
Tstg
temperature
Note 1-1: The mean output current is a mean value measured over 100ms.
250 mW
-20
75
°C
-65
125
Note: We assume that the measurements for the allowable operating ranges and electrical characteristics described in
this document are performed with the chip mounted in a package.
Although this product is shipped in chip form, the characteristic values listed in this document are measured with
this IC mounted on a SANYO-designated package at operating ambient temperature range of -20°C to +70°C.
The specifications of this product in package form or in chip forms are basically identical, however, the
characteristics of the product in chip form may vary depending on the board on which the product is mounted, the
bonding pressure, and the type of mold resin used.
No.A1228-13/25